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January 2007

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Subject:
From:
Lee parker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lee parker <[log in to unmask]>
Date:
Fri, 12 Jan 2007 10:17:56 -0500
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Richard

While in the AT&T facility at Richmond we had several complaints that due to 
poor wetting of the surface finish the components were being sheared from 
the board. When we investigated we found that the failure was not shear but 
for the most part tensile. When we looked at the assembly operation we 
always found that during assembly the boards were being bent and the failure 
was in bending which explained why the stresses were for the most part 
tensile. If you bend any board enough you will break the SMT joints. A pure 
shear failure is much less likely to occur.

Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389


----- Original Message ----- 
From: "Todd, Richard" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, January 11, 2007 6:03 PM
Subject: [TN] SMD Capacitor Shear Strength


> I have a question for the oracle . . .
>
> Does anyone know what is the solder joint shear strength for an 0603
> capacitor (assuming standard eutectic solder)?
>
>
>
> Regards,
>
>
>
> Rick Todd
>
> Senior Engineer
>
> Process Quality Engineering
>
>
>
> Panasonic Automotive Systems Company of America
>
> Division of Panasonic Corporation of North America
>
> 776 Highway 74 South, Peachtree City, GA 30269
>
> 770-515-1087 Direct
>
> 678-458-2887 Cell
>
> 770-486-2248 Fax
>
> [log in to unmask] <mailto:[log in to unmask]>
>
>
>
>
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