I couldn't see any conclusive CAF based on the photos... Must be my old eye
sight failing me... (or slow brain process of info)...jk

abcd

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of stephengregory5849
Sent: Thursday, January 11, 2007 11:14 PM
To: [log in to unmask]
Subject: Re: [TN] Is this CAF?


Just to give a link to my page:

http://www.stevezeva.homestead.com

The pictures are at the bottom of the page...

-Steve Gregory-

  ----- Original Message -----
  From: - Bogert
  To: TechNet
  Cc: Steve Gregory
  Sent: Thursday, January 11, 2007 5:26 PM
  Subject: Is this CAF?


  January 11, 2007

  This is an e-mail for all you CAF experts out there.

  We have an OEM that manufactures a 10-layer VME backplane assembly that
has press-fit power studs installed in the backplane.  The manufacturer has
experienced system level test failures.  Some of these failures did not
occur during the initial testing but the assemblies failed at some
subsequent time during testing.  The failure mode was shorting of the +12V
layer 1 to the +5V layer 3 via the pressed-in power studs.  The OEM had the
backplane sent to an outside lab to determine the root cause of the problem.
After looking at the pictures taken from the evaluation, it appears to me
that the problem could be due to CAF because of the damage done to the glass
fibers in the FR4 board material.  CAF is also suspected since the test
failures do not occur on initial testing of the equipment.  We verified that
the PWB conductor spacing meets IPC-2221 requirements.  Another factor is,
we believe the OEM may have used some Type H flux per J-STD-004.  Not sure
this is an issue unless some of the flux residue entere

  Steve Gregory was kind enough to post 13 pictures on his web site.  They
are files GLB CAF # 1 through GLB CAF#13.

  Can folks identify whether CAF could be the root cause of the problem?
Any help would be appreciated.

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