TECHNET Archives

January 2007

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Creswick, Steven" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Creswick, Steven
Date:
Fri, 12 Jan 2007 06:20:29 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (93 lines)
Todd,

From what I have generated, as a generic number you may expect something
like 1-2.5Kg, depending on solder alloy/type, component standoff, and
pad/fillet geometry etc.

These numbers are for shearing against the body of the component [aka -
the shear tool contacts both terminations during shear]

Height of the shear tool during shear can also play a significant roll
as too low a height shears the solder [giving a greater shear value],
and too high somewhat rolls the component out of the solder [giving a
lesser value].

Hope this helps a bit.  I would be interested to know if there is a
standard for this procedure - specifically for SMD's, that is.

Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Todd, Richard
Sent: Thursday, January 11, 2007 6:04 PM
To: [log in to unmask]
Subject: [TN] SMD Capacitor Shear Strength

I have a question for the oracle . . . 

Does anyone know what is the solder joint shear strength for an 0603
capacitor (assuming standard eutectic solder)?

 

Regards,

 

Rick Todd

Senior Engineer

Process Quality Engineering

 

Panasonic Automotive Systems Company of America

Division of Panasonic Corporation of North America

776 Highway 74 South, Peachtree City, GA 30269

770-515-1087 Direct

678-458-2887 Cell

770-486-2248 Fax

[log in to unmask] <mailto:[log in to unmask]> 

 


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text
in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at:
http://listserv.ipc.org/archives
Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
-----------------------------------------------------



THE INFORMATION CONTAINED IN THIS E-MAIL MESSAGE AND ANY ATTACHMENTS SENT FROM GENTEX CORPORATION IS GENTEX CONFIDENTIAL INFORMATION INTENDED ONLY FOR THE PERSONAL USE OF THE INDIVIDUAL OR ENTITY NAMED ABOVE. If you are not the intended recipient, you are hereby notified that any review, distribution, or copying of this communication is strictly prohibited.  If you have received this communication in error, please immediately notify the sender by return e-mail, and delete this e-mail message and any attachments from your computer.  




---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------

ATOM RSS1 RSS2