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January 2007

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Subject:
From:
Peter Swanson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Peter Swanson <[log in to unmask]>
Date:
Wed, 3 Jan 2007 15:36:34 -0000
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Nigel,

You rightly draw the distinction between a) the types of temporary masks
which are pre-applied by screen printing, usually by the pcb fabricator
and b) the temporary masks which are dispensed on by the guys doing the
assembly. They are different.

Whilst it is obviously desirable to have this job done by your fab guy,
as you pointed out, it isn't always straightforward. In particular, I
remember a few years back when the process window on the screenable
materials wasn't very wide, resulting in problems from under/over cure,
removal, etc. Maybe the formulations are more robust today.

It is possible to make the "in-house" dispensable types more appealing.
Dispensing can be by fairly inexpensive robotics. Curing can be quick by
heat or UV. Is this approach an option?

Regards,
Peter
--------------------------------------------------------
Peter Swanson           [log in to unmask]
INTERTRONICS                http://www.intertronics.co.uk
Tel: +44 1865 842842                   Oxfordshire, England

INTERTRONICS is dedicated to providing quality material, consumable 
and equipment solutions to the high technology, high performance 
assembly industries, incorporating outstanding levels of technical 
support and customer service.

Read our blog! http://www.intertronics.co.uk/blog/blog.htm

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of N Burtt
Sent: 03 January 2007 09:27
To: [log in to unmask]
Subject: [TN] Temporary peelable solder masks

I'm being told that these are not widely used in USA, the common types
used here in the UK (Peters and Electramask) not readily available, and
they create packaging and shipping problems... thus US PCB suppliers
reluctant to supply PCBs with peelable masking applied. Is this true?

Now they are by no means a perfect solution to protecting holes on a PCB
during wavesolder, but am not aware of another way of doing so in a
no-clean RoHS process if fixturing can't do it. What do US PCB
assemblers do if pre- applied peelable masking is really not viable?
Other ideas?

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