LEADFREE Archives

January 2007

Leadfree@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
David Suraski <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Sat, 20 Jan 2007 01:43:52 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (93 lines)
Just two comments:

"We should have left 63/37 well enough alone.": The solder companies (at
least the one I can speak for) do not disagree with this.

"Before you solder companies come up with a thousand "new" patented
alloys, just make sure you do all of the necessary homework and due
diligence (qualification) before you pitch them on the market.": I've
never heard an alloy pitched for ALL applications.  Sn63 did not work
well for EVERY application, so why would anyone expect an alternative
to. Alloy development will certainly continue for the myriad niche
applications, not to mention as a means to incrementally improve what we
already have. In my experience, developing products with the promise to
"fix" particular issues that companies cannot overcome otherwise are
quite welcome.  

Perhaps expectations should be tempered.

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Friday, January 19, 2007 11:52 PM
To: [log in to unmask]
Subject: Re: [LF] SAC+, SACN and Low-Ag SAC Solder Ball Alloy

I think I agree with Joe.
Before you solder companies come up with a thousand "new" patented
alloys, just make sure you do all of the necessary homework and due
diligence (qualification) before you pitch them on the market. 

The industry is already having enough trouble dealing with the
unforecasted reliability issues with increased copper dissolution rates,
different IMFs with different brittleness characteristics for different
component finishes, and dozens of other issues with the lead-free alloys
we are currently dealing with. Perhaps the last thing we need right now
are new alloys that promise to "fix" certain issues. You don't get
something for nothing.

We should have left 63/37 well enough alone.

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Joe Fjelstad
Sent: Friday, January 19, 2007 9:36 AM
To: [log in to unmask]
Subject: Re: [LF] SAC+, SACN and Low-Ag SAC Solder Ball Alloy

Hmmm... the word "patent" is used three times in this message. Is there
a subtle message there?
 
The following is from the European patent data base:
 
"Approximately 2078 results found in the Worldwide database for:  lead
free in the title"
 
Watch out for the mine field.
 
Traditional solder is looking better all the time... ;-)  
 
Joe 

------------------------------------------------------------------------
-------Leadfee Mail List provided as a service by IPC using LISTSERV
1.8d To unsubscribe, send a message to [log in to unmask] with following
text in the BODY (NOT the subject field): SIGNOFF Leadfree To
temporarily stop/(start) delivery of Leadree for vacation breaks send:
SET Leadfree NOMAIL/(MAIL) Search previous postings at:
http://listserv.ipc.org/archives Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
------------------------------------------------------------------------
-------

------------------------------------------------------------------------
-------Leadfee Mail List provided as a service by IPC using LISTSERV
1.8d To unsubscribe, send a message to [log in to unmask] with following
text in the BODY (NOT the subject field): SIGNOFF Leadfree To
temporarily stop/(start) delivery of Leadree for vacation breaks send:
SET Leadfree NOMAIL/(MAIL) Search previous postings at:
http://listserv.ipc.org/archives Please visit IPC web site
http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100
ext.2815
------------------------------------------------------------------------
-------

-------------------------------------------------------------------------------Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop/(start) delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL/(MAIL)
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-------------------------------------------------------------------------------

ATOM RSS1 RSS2