I think I agree with Joe.
Before you solder companies come up with a thousand "new" patented
alloys, just make sure you do all of the necessary homework and due
diligence (qualification) before you pitch them on the market. 

The industry is already having enough trouble dealing with the
unforecasted reliability issues with increased copper dissolution rates,
different IMFs with different brittleness characteristics for different
component finishes, and dozens of other issues with the lead-free alloys
we are currently dealing with. Perhaps the last thing we need right now
are new alloys that promise to "fix" certain issues. You don't get
something for nothing.

We should have left 63/37 well enough alone.

-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of Joe Fjelstad
Sent: Friday, January 19, 2007 9:36 AM
To: [log in to unmask]
Subject: Re: [LF] SAC+, SACN and Low-Ag SAC Solder Ball Alloy

Hmmm... the word "patent" is used three times in this message. Is there
a subtle message there?
 
The following is from the European patent data base:
 
"Approximately 2078 results found in the Worldwide database for:  lead
free in the title"
 
Watch out for the mine field.
 
Traditional solder is looking better all the time... ;-)  
 
Joe 

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