Hello TechNet,
Did anybody heard of SAC+ and SACN lead-free solder alloy?
From a recent Xilinx PCN
(http://www.xilinx.com/bvdocs/notifications/xcn06024.pdf), I learnt that
SACN which looks like a standard SAC with a minor Ni addition is
becoming standard for BGA ball alloy composition. I have no idea of what
SAC+ could be (visibly not Ni...).
It looks also that BGA ball alloys are evolving towards low-Ag SAC like
SAC101 or SAC105. Did anybody evaluate the impact of these compositions
on high-rel. applications in backward and in full lead-free assembly?
Best regards,
A. Grivon
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