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January 2007

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Subject:
From:
Tina Nerad <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Fri, 12 Jan 2007 10:14:10 -0600
Content-Type:
text/plain
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text/plain (25 lines)
Solder Joint Microvoiding: How Reliable is Your Information?
January 25, 2007 - 10:00 am - 11:00 am (CT), 11:00 am - 12:00 pm (ET)

Presented by: 
Don Cullen, Director of OEM and Assembly Applications, MacDermid, Inc. 
John Swanson, Director of Final Finishes and Interconnects, MacDermid,
Inc. 
Microvoids have become one of the most widely discussed PCB topics of
the post-RoHS world. Solder joint microvoiding emerged as a serious
reliability threat during a time of drastic changes in electronics
manufacturing: the lead free transition, use of high-stress BGA
attachment, and deployment of new PCB surface finishes. Over the past
three years, the topic has developed into a critical area of interest. 
Register now to find out ore about this critical subject. Cut and paste
http://www.ipc.org/calendar/2007/SolderJoint_Microvoiding_01_29_07/Solde
rjoint_Webcast_01_29_07.htm into your browser.

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