Subject: | |
From: | |
Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Fri, 12 Jan 2007 10:14:10 -0600 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Solder Joint Microvoiding: How Reliable is Your Information?
January 25, 2007 - 10:00 am - 11:00 am (CT), 11:00 am - 12:00 pm (ET)
Presented by:
Don Cullen, Director of OEM and Assembly Applications, MacDermid, Inc.
John Swanson, Director of Final Finishes and Interconnects, MacDermid,
Inc.
Microvoids have become one of the most widely discussed PCB topics of
the post-RoHS world. Solder joint microvoiding emerged as a serious
reliability threat during a time of drastic changes in electronics
manufacturing: the lead free transition, use of high-stress BGA
attachment, and deployment of new PCB surface finishes. Over the past
three years, the topic has developed into a critical area of interest.
Register now to find out ore about this critical subject. Cut and paste
http://www.ipc.org/calendar/2007/SolderJoint_Microvoiding_01_29_07/Solde
rjoint_Webcast_01_29_07.htm into your browser.
-------------------------------------------------------------------------------Leadfee Mail List provided as a service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop/(start) delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL/(MAIL)
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-------------------------------------------------------------------------------
|
|
|