Hmmm, don't think you could universally go with 'thermal pad', low-power
devices in QFN's -don't- need them as a thermal sink, and don't need
thermal vias in the pad. In those cases the pads are there, and
necessary, for the mechanical support.
Gary Crowell, Sr., PE; CID+
Micron Technology
> -----Original Message-----
> From: DesignerCouncil [mailto:[log in to unmask]] On
> Behalf Of Brand, Rodney
> Sent: Wednesday, January 31, 2007 1:22 PM
> To: [log in to unmask]
> Subject: Re: [DC] naming conventions?
>
> Definitely not a die pad, a die pad is used to attach a die to a
> substrate.
> I like thermal pad myself, that is what the function is.
> MYHO
> Rodney
>
> -----Original Message-----
> From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of
> Brooks,Bill
> Sent: Wednesday, January 31, 2007 3:00 PM
> To: [log in to unmask]
> Subject: [DC] naming conventions?
>
> Leslie Gomez and I were discussing standards and Cad library
> symbols and
> footprints and this subject came up...
>
> The question has been asked... is there a 'standard' naming convention
> for
> the large thermal pads used on the underside of chips like the QFN
> package?
> Some have called it a 'belly pad' others have called it a 'paddle
> pin'...
> some call it a 'die pad'.
> What do you call it and has anyone coined a 'standard name' for it?
> (Inquiring minds want to know...) :-)
>
> Reference:
> http://www.freescale.com/files/analog/doc/app_note/AN1902.pdf
> <http://www.freescale.com/files/analog/doc/app_note/AN1902.pdf>
>
>
> Best regards,
>
>
> Bill Brooks - KG6VVP
> PCB Design Engineer, C.I.D.+, C.I.I.
> DATRON World Communications, Inc.
> 3030 Enterprise Court, Vista, CA 92083
> http://www.dtwc.com
> Tel: (760)597-1500 Fax: (760)597-1510
> e-mail:[log in to unmask]
> IPC Designers Council, San Diego Chapter
> http://dcchapters.ipc.org/SanDiego/
> Personal Website:
> http://pcbwizards.com
>
>
>
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