Bill,
We've seen vendor datasheets refer to this as "Exposed Pad",
"Ground Pad", "Heat Sink", etc.
Our first preference is to match the PDF, but when second source
parts have a different pad name, this is not an option.
So, we settled in on a generic term of "Heat Sink" (because that's
what it really is) and we use a pin ~number~ of "HS".
Thank you,
Kevin L. Seaman
OrCAD CIS & Allegro PCB Library Liaison
Sr. Staff PCB Layout Engineer
Broadcom Corp. Irvine, CA
(949) 926-5656 (ext. 65656)
========================= Original Message ==========================
From: DesignerCouncil [mailto:[log in to unmask]] On Behalf Of Brooks,Bill
Sent: Wednesday, January 31, 2007 12:00 PM
To: [log in to unmask]
Subject: [DC] naming conventions?
Leslie Gomez and I were discussing standards and Cad library symbols and
footprints and this subject came up...
The question has been asked... is there a 'standard' naming convention for
the large thermal pads used on the underside of chips like the QFN package?
Some have called it a 'belly pad' others have called it a 'paddle pin'...
some call it a 'die pad'.
What do you call it and has anyone coined a 'standard name' for it?
(Inquiring minds want to know...) :-)
Reference: http://www.freescale.com/files/analog/doc/app_note/AN1902.pdf
<http://www.freescale.com/files/analog/doc/app_note/AN1902.pdf>
Best regards,
Bill Brooks - KG6VVP
PCB Design Engineer, C.I.D.+, C.I.I.
DATRON World Communications, Inc.
3030 Enterprise Court, Vista, CA 92083
http://www.dtwc.com
Tel: (760)597-1500 Fax: (760)597-1510
e-mail:[log in to unmask]
IPC Designers Council, San Diego Chapter
http://dcchapters.ipc.org/SanDiego/
Personal Website:
http://pcbwizards.com
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