Leslie Gomez and I were discussing standards and Cad library symbols and
footprints and this subject came up... 

The question has been asked... is there a 'standard' naming convention for
the large thermal pads used on the underside of chips like the QFN package? 
Some have called it a 'belly pad' others have called it a 'paddle pin'...
some call it a 'die pad'. 
What do you call it and has anyone coined a 'standard name' for it? 
(Inquiring minds want to know...) :-)

Reference:  http://www.freescale.com/files/analog/doc/app_note/AN1902.pdf
<http://www.freescale.com/files/analog/doc/app_note/AN1902.pdf> 


Best regards, 


Bill Brooks - KG6VVP
PCB Design Engineer, C.I.D.+, C.I.I.
DATRON World Communications, Inc.
3030 Enterprise Court, Vista, CA 92083
http://www.dtwc.com
Tel: (760)597-1500 Fax: (760)597-1510
e-mail:[log in to unmask]
IPC Designers Council, San Diego Chapter 
http://dcchapters.ipc.org/SanDiego/
Personal Website:
http://pcbwizards.com 



---------------------------------------------------------------------------------
DesignerCouncil Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF DesignerCouncil.
To temporarily stop/(restart) delivery of DesignerCouncil send: SET DesignerCouncil NOMAIL/(MAIL)
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
---------------------------------------------------------------------------------