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Date: | Tue, 30 Jan 2007 13:46:33 -0500 |
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Darrel,
as already mentionned, even if you could work out a metallurgical joining, more or less reliable, the main issues are the temperature and MSD ratings of the BGA. If the part is rated under 240C, don't think about using an LF process or reballing with LF balls.
Since you have that 5/6 compliance, why don't you run the product on SnPb paste? The only thing keeping you from doing that would be if you had other BGAs on the board, that are LF. Although recent studies show that LF BGAs on SnPb paste are reliable, this is still not widely accepted.
Regards,
Ioan
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Darrel Therriault
Sent: Tuesday, January 30, 2007 1:17 PM
To: [log in to unmask]
Subject: Re: [TN] Leaded and unleaded BGAs
Richard/Technet,
Sorry for the confusion and my improper use of terms.
What I intended to say was we have BGAs with Pb balls. I was wondering if
there was an accepted process to attach those on a board that has non-Pb
components by either reballing them with nonPb balls, using SRT rework or
some profile that might allow both Pb and nonPb components to be run at
the same time.
If there is no acceptable method, I either need to consume them in Pb
assemblies (non-RoHS) or take an E&O hit on the Pb components.
DJT
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