Subject: | |
From: | |
Reply To: | |
Date: | Tue, 23 Jan 2007 13:48:53 -0600 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Solder Joint Microvoiding: How Reliable is Your Information?
January 25, 2007 - 10:00 am - 11:00 am (CT), 11:00 am - 12:00 pm (ET)
Microvoids have become one of the most widely discussed PCB topics of
the post-RoHS world. Solder joint microvoiding emerged as a serious
reliability threat during a time of drastic change in electronics
manufacturing: the lead free transition, use of high-stress BGA
attachment, and deployment of new PCB surface finishes. Over the past
three years, the topic has developed into a critical area of interest.
Presented by:
Don Cullen, Director of OEM and Assembly Applications, MacDermid, Inc.
John Swanson, Director of Final Finishes and Interconnects, MacDermid,
Inc.
To register for this webcast, please cut and paste
www.ipc.org/solderjointwc07 into your browser.
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|