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Date: | Fri, 19 Jan 2007 14:48:17 -0600 |
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Thank you again, Werner!
________________________________
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Friday, January 19, 2007 1:22 PM
To: Stadem, Richard D.; [log in to unmask]; [log in to unmask]
Cc: [log in to unmask]
Subject: Re: [TN] Minimum solder reflow temperatures for ENIG board
finish
Hi Richard &Tom,
The article you are referring to: "Soldering: Quality and Reliability
Issues" was published in global SMT & Packaging Vol. 1, No. 2, August
2001. You may also be interested in the column "The Case Against ENIG,"
Global SMT & Packaging, Vol. 5, No. 6, June/July 2005 [EU-edition].
Werner
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