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December 2006

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Subject:
From:
Robert Lazzara <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 8 Dec 2006 16:21:31 EST
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I think the substrate itself is far more hygroscopic than either the mask  or 
the lettering ink.
 
Unless the inks aren't fully cured.
 
But to your point: It's quite possible to have a polymer mask and a UV  
letter screen.
Or combinations including epoxy inks.
 
So out-gassing, if any, would not necessarily have to be the same for the  
solder mask as for the silk screen.
 
But I'm curious: Why letter screen at-all?
- Are these boards being hand assembled?
- Is the lettering functional for repair purposes?
 
Most of the boards we fab today are so dense you can't even see the  
post-assembly board. So unless you're hand-popping parts why risk ink-on-pads --  with 
or without out-gassing?
 
Think I'll go tear some tags off of pillows...
 
 
ROBERT LAZZARA
VP, Business Development
T: (800) 560-9457
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W:_  www.CircuitConnectUSA.com_ (http://www.circuitconnectusa.com/) 



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