Slowing the board travel through the WS, top and bottom fluxing,
preheating ground plane/thick boards improves PTH solder penetration.
Ramon
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mike Fenner
Sent: Friday, December 01, 2006 3:29 AM
To: [log in to unmask]
Subject: Re: [TN] Solder Voids in Hole barrel after W/S
Assuming you have adequate top and bottom preheating the cause is almost
certainly poor PCB fabrication. You could try baking out the boards
before soldering to see if this has an effect on the incidence/severity.
This won't cure the problem but a change will point to the cause.
Regards
Mike Fenner
Indium Corporation
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Irving Lee
Sent: Thursday, November 30, 2006 4:31 PM
To: [log in to unmask]
Subject: [TN] Solder Voids in Hole barrel after W/S
What are the critical control factors to avoid solder voids in hole
barrel after W/S ?
We have checked following items , but still have serious solder void
problem .
1. Good Hole Wall Quality
2. Good solderability for component tail 3. Good HASL thickness 4. No
Ionic contamination
Irving Lee
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