CALL FOR PARTICIPATION

IPC International Conference on Lead Free Materials and Surface Finishes
May 8-9, 2007 - San Jose, CA

Your customers need your help.  OEMs, fabricators, and designers are all
working to optimize their products and processes for lead free
production.  Can you share solutions with the supply chain?

Engineers and designers must consider new laminate materials, new
component finishes, new board finishes and the interactions between
these materials and the soldering and assembly process. These issues
will significantly impact operations of PWB and IC substrate
fabricators, as well as EMS/ODM companies.

IPC is seeking speakers to participate in the first international
conference dedicated specifically to addressing the issues of lead free
materials and surfaces finishes in lead free electronics. To submit an
abstract submission or course proposal, please cut and paste
www.ipc.org/LFMaterials into your browser or e-mail your submission to
[log in to unmask]

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