Scott,

I tend to agree with you [having ASM's and F&K's], but I am thinking of our automatics, etc.  Might you be as well?

Definitely each [automatic] machine brand has its own particular strengths and weaknesses, but much is determined by the requirements of the application.

I had always received good support from F&K, however.  And that is what 'after the sale' is all about.



Syed, do a good job of knowing what it is that you require.  Accuracy, repeatability, rate, etc.  For high accuracy, one sacrifices speed.  For a manual operation this should not be an issue.  Generic [automatic] die bonders will have accuracies of ~ +/- 0.001"

I would also add Semiconductor Equipment Corp {SEC - Moorpark, CA} to your list of manual bonders as well as Westbond, also in CA.  I don't have links at my fingertips but can provide a link or names if you have a problem finding them.  Sometimes their Mfrs reps know of good used equipment which can be re-furbished at the factory for a reasonable fee.

SEC used to have a Model 410 flip chip bonder that I was able to get accuracies of ~+/- 5µm at room temp and ~+/-12-15µm at 200°C.  Maybe this is more of what you are looking for.

Sometimes a wise shopper can find a good deal on used equipment at Bid Service, etc. - but that is more buyer-beware.  I recommend that you know how it is supposed to work and what it can do before going the used equipment route without involving the manufacturer.

Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Scott Westheimer
Sent: Friday, December 01, 2006 1:46 AM
To: [log in to unmask]
Subject: Re: [TN] Die Bonder Recommendation

Do not know if I would completely agree with Joyce. We have ASM, Datacom and
Siemens's( Formally F&K ), and all seem to have there pros and cons. The
pricieest seems to give us the most problems and not sure if it was worth
it.one


>From: Joyce Koo <[log in to unmask]>
>Reply-To: [log in to unmask]
>To: [log in to unmask]
>Subject: Re: [TN] Die Bonder Recommendation
>Date: Thu, 30 Nov 2006 17:29:16 -0500
>
>ASM is a good one for the price.  K&S recently got into the market.  both
>of
>them are wire bonding equipment vendors, know very well how critical is the
>die attach requirements...Normally, the more you pay, the better...;-)
>
>abcd
>
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]]On Behalf Of Syed Ahmad
>Sent: Thursday, November 30, 2006 5:08 PM
>To: [log in to unmask]
>Subject: [TN] Die Bonder Recommendation
>
>
>Would someone have a recommendation for a manual or semiauto die bonder?
>Thanks.
>Syed.
>
>Syed Sajid Ahmad
>Center for Nanoscale Science and Engineering
>North Dakota State University Fargo ND
>701 231 5880
>


THE INFORMATION CONTAINED IN THIS E-MAIL MESSAGE AND ANY ATTACHMENTS SENT FROM GENTEX CORPORATION IS GENTEX CONFIDENTIAL INFORMATION INTENDED ONLY FOR THE PERSONAL USE OF THE INDIVIDUAL OR ENTITY NAMED ABOVE. If you are not the intended recipient, you are hereby notified that any review, distribution, or copying of this communication is strictly prohibited.  If you have received this communication in error, please immediately notify the sender by return e-mail, and delete this e-mail message and any attachments from your computer.  




---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------