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December 2006

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Subject:
From:
Anil Kher <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Sat, 30 Dec 2006 12:59:45 +0530
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Lee

You are right about flash gold - but 15 mins is Ok to produce 2 um gold and
with variation certain areas can be twice as higher. I have a doubt however
when u say over copper. If it is immersion gold over copper it could be
Uyemura direct immersion gold which can replace enig - and quite non porous
and only on pads and holes. Otherwise it has to be flash electrolytic over 5
um nickel all over the track..

Best wishes and a happy new year to you all.

Anil Kher
 

-----Original Message-----
From: Lee parker [mailto:[log in to unmask]] 
Sent: Saturday, December 30, 2006 3:36 AM
Subject: Re: Questions on ENIG VS gold plating

Werner

If they were using the flash gold chemistry it would require over 12 hours
to plate enough gold to cause an embrittlement problem. I am sure there are
suppliers that use one process and sell it as another. By the way, a
necessary but not sufficient requirement for flash gold is that all copper
features including those under the soldermask be gold plated. Do you recall
if this was the case?

Happy New Year

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389


----- Original Message -----
From: "Werner Engelmaier" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, December 29, 2006 3:34 PM
Subject: Re: [TN] Questions on ENIG VS gold plating


Hi Lee,
What I found was significantly more than 2 micro-inches of Au over Ni. It 
was
supposed to be electro-plated "flash Au" but sure was certainly much more
than a flash. However, I have no idea what plating chemistry was actually 
used—
you know what communicating with a Chinese client regarding another Chinese
vendor is like.


Happy New Year,
Werner

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