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December 2006

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Subject:
From:
Lee parker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lee parker <[log in to unmask]>
Date:
Fri, 29 Dec 2006 17:06:26 -0500
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text/plain
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Werner

If they were using the flash gold chemistry it would require over 12 hours 
to plate enough gold to cause an embrittlement problem. I am sure there are 
suppliers that use one process and sell it as another. By the way, a 
necessary but not sufficient requirement for flash gold is that all copper 
features including those under the soldermask be gold plated. Do you recall 
if this was the case?

Happy New Year

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389


----- Original Message ----- 
From: "Werner Engelmaier" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, December 29, 2006 3:34 PM
Subject: Re: [TN] Questions on ENIG VS gold plating


Hi Lee,
What I found was significantly more than 2 micro-inches of Au over Ni. It 
was
supposed to be electro-plated "flash Au" but sure was certainly much more
than a flash. However, I have no idea what plating chemistry was actually 
used—
you know what communicating with a Chinese client regarding another Chinese
vendor is like.


Happy New Year,
Werner

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