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Subject:
From:
Leo Higgins <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Leo Higgins <[log in to unmask]>
Date:
Fri, 29 Dec 2006 12:30:26 -0800
Content-Type:
text/plain
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text/plain (249 lines)
Perhaps not relevant for solderability due to presence of Pd under the Au, but the TI spec for NiPdAu plated leadframes is 0.003 - 0.015 micrometers (0.12 - 0.6 micro-inches).  The lead frame suppliers use electrolytic processes to plate all three metal layers, and can control the Au to this range.


Best regards,
Leo

          
Leo M. Higgins III, Ph.D.
Sr. Vice President, Engg and Technology
ASAT, Inc. 
13809 Research Blvd., Suite 635
Austin, Texas     78750

office phone   512-249-4758
mobile           512-423-2002
[log in to unmask]
www.asat.com



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Lee parker
Sent: Friday, December 29, 2006 1:38 PM
To: [log in to unmask]
Subject: Re: [TN] Questions on ENIG VS gold plating


Guy

I realize that with conventional gold plating a large variation in gold
plating is common. This has not been a problem with flash gold probably
because it uses a different chemistry that applies a much more level
coating. Also the plating covers all copper features which reduces the
likelihood of hot spots.

Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389



----- Original Message ----- 
From: "Guy Ramsey" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, December 29, 2006 2:32 PM
Subject: Re: [TN] Questions on ENIG VS gold plating


> Two would be fine if you could control the thickness across the board.
> I am not aware of any either. But, electroplated gold is another story.
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee parker
> Sent: Friday, December 29, 2006 1:55 PM
> To: [log in to unmask]
> Subject: Re: [TN] Questions on ENIG VS gold plating
>
> Guy
>
> If two micro inches of gold is an embrittlement threat, then ENIG must be
> considered equally as dangerous. I am hardly a fan of ENIG, but I am 
> unaware
> of any documented ENIG embrittlement failures.
>
> Best regards
>
> Lee
>
> J. Lee Parker, Ph.D.
> JLP Consultants LLC
> 804 779 3389
>
>
> ----- Original Message -----
> From: "Guy Ramsey" <[log in to unmask]>
> To: <[log in to unmask]>
> Sent: Friday, December 29, 2006 1:09 PM
> Subject: Re: [TN] Questions on ENIG VS gold plating
>
>
> > I didn't read your paper but my experience mirrors Werner's. It is very
> > difficult to get a thin, even, always present electroplate. A two micro
> > inch
> > minimum might easily result in spots that are thick enough to cause
> > brittle
> > solder connections. A two micro inch maximum might easily fail to 
> > protect
> > the nickel.
> >
> >
> > -----Original Message-----
> > From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee parker
> > Sent: Friday, December 29, 2006 12:56 PM
> > To: [log in to unmask]
> > Subject: Re: [TN] Questions on ENIG VS gold plating
> >
> > Werner
> >
> > This could not be flash gold since in this process the gold thickness is
> > approximately 2 micro inches, which of course is where the name
> > originated.
> > The advantage over ENIG is that the porosity is greatly reduced.
> >
> > I am sure you will agree two micro inches of gold is not going to cause
> > embrittlement. I imagine what you have is typical plated gold with uses 
> > a
> > completely different and much more expensive chemistry.
> >
> > Best regards
> >
> > Lee
> >
> > J. Lee Parker, Ph.D.
> > JLP Consultants LLC
> > 804 779 3389
> >
> >
> > ----- Original Message -----
> > From: "Werner Engelmaier" <[log in to unmask]>
> > To: <[log in to unmask]>
> > Sent: Friday, December 29, 2006 12:47 PM
> > Subject: Re: [TN] Questions on ENIG VS gold plating
> >
> >
> > > In a message dated 12/29/06 11:25:43, [log in to unmask] writes:
> > > > Many Asian shops use what they call "flash gold"
> > > > which is electro plated gold over nickel.
> > > >
> > > Hi Lee,
> > > True enough, but 2 of my clients in China had gold-embrittlement
> > > failures
> > > because some of their product had too much Au on it.
> > >
> > > Werner
> > >
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