Since IPC does not appear to have a copy of the paper it is enclosed.

Best regards

Lee

J. L. Parker Ph.D.
JLP Consultants LLC
(804) 779 3389


-----Original Message-----
From: Guy Ramsey [mailto:[log in to unmask]]
Sent: Friday, December 29, 2006 1:10 PM
To: 'TechNet E-Mail Forum'; 'Lee parker'
Subject: RE: [TN] Questions on ENIG VS gold plating

I didn't read your paper but my experience mirrors Werner's. It is very
difficult to get a thin, even, always present electroplate. A two micro
inch
minimum might easily result in spots that are thick enough to cause
brittle
solder connections. A two micro inch maximum might easily fail to protect
the nickel.


-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Lee parker
Sent: Friday, December 29, 2006 12:56 PM
To: [log in to unmask]
Subject: Re: [TN] Questions on ENIG VS gold plating

Werner

This could not be flash gold since in this process the gold thickness is
approximately 2 micro inches, which of course is where the name
originated.
The advantage over ENIG is that the porosity is greatly reduced.

I am sure you will agree two micro inches of gold is not going to cause
embrittlement. I imagine what you have is typical plated gold with uses a
completely different and much more expensive chemistry.

Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389


----- Original Message -----
From: "Werner Engelmaier" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, December 29, 2006 12:47 PM
Subject: Re: [TN] Questions on ENIG VS gold plating


> In a message dated 12/29/06 11:25:43, [log in to unmask] writes:
> > Many Asian shops use what they call "flash gold"
> > which is electro plated gold over nickel.
> >
> Hi Lee,
> True enough, but 2 of my clients in China had gold-embrittlement
failures
> because some of their product had too much Au on it.
>
> Werner
>
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