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December 2006

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Subject:
From:
Lee parker <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Lee parker <[log in to unmask]>
Date:
Fri, 29 Dec 2006 11:23:42 -0500
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text/plain
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text/plain (92 lines)
Dave

Concerning gold plating. Many Asian shops use what they call "flash gold" 
which is electro plated gold over nickel. Urmi Ray and I gave a paper at 
last year's Apex on this technology which has been successfully used be 
numerous OEMs.

Best regards

Lee

J. Lee Parker, Ph.D.
JLP Consultants LLC
804 779 3389

----- Original Message ----- 
From: "David Harman" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Friday, December 29, 2006 1:09 AM
Subject: [TN] Questions on ENIG VS gold plating


I need some help in understanding.



Are specified requirements are emersion gold plate per

Mil-G-45204 type 2, gold plating thickness maximum of .00003 inches (30

micro inches) over minimum of .00005 inches (50 micro inches) nickel for our 
PCB



Is this a standard that is used widely, any other recommendations?



My supplier has indicated the following.

The specifications you listed in your e-mail do not apply to the ENIG finish 
(Immersion Gold, electroless nickel)

Mil -G- 45204 refers to Electroplated Gold, Type 2 is 99.0% purity



IPC 6012B Table 3-2 requirements for ENIG are 1.97 u" minimum immersion gold 
and 118 u" minimum of electroless nickel.





Which is a better specification? What would give better quality / 
reliability?  Is there anyway to correlate the two different specifications.



Can I correlate ENIG specs, to that of gold plating.?



Dave



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