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| Date: | Fri, 29 Dec 2006 10:12:42 -0600 |
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Hello Dave and Happy Holidays! The IPC-4552 "Specification for Electroless
Nickel/Immersion Gold (ENIG) for Printed Circuit Boards" is a more
appropriate requirements document for printed circuit board applications
than the MIL-G-45204 specification. As Guy Ramsey and your supplier have
indicated, it is not possible to achieve a 30 uinch gold thickness with an
immersion gold plating system. The IPC 4552 specification was developed
specifically for ENIG finishes applied to printed circuit boards by the
electronics industry and following its requirements should give you an ENIG
finish that will meet your needs for most applications.
Dave Hillman
Rockwell Collins
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David Harman
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OM> To
Sent by: TechNet [log in to unmask]
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Subject
12/29/2006 12:09 [TN] Questions on ENIG VS gold
AM plating
Please respond to
TechNet E-Mail
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; Please respond
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David Harman
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OM>
I need some help in understanding.
Are specified requirements are emersion gold plate per
Mil-G-45204 type 2, gold plating thickness maximum of .00003 inches (30
micro inches) over minimum of .00005 inches (50 micro inches) nickel for
our PCB
Is this a standard that is used widely, any other recommendations?
My supplier has indicated the following.
The specifications you listed in your e-mail do not apply to the ENIG
finish (Immersion Gold, electroless nickel)
Mil -G- 45204 refers to Electroplated Gold, Type 2 is 99.0% purity
IPC 6012B Table 3-2 requirements for ENIG are 1.97 u" minimum immersion
gold and 118 u" minimum of electroless nickel.
Which is a better specification? What would give better quality /
reliability? Is there anyway to correlate the two different
specifications.
Can I correlate ENIG specs, to that of gold plating.?
Dave
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