Jim,
Although your attachment does not travel thru Technet, I found that this
package is a QFN style component.
I suggest a stencil opening design as follows:
perimeter leads: 1 mil width reduction, 100% length, 2 mil corner radii
center lug: print 50 - 60% of the the metallized area
Use the area ratio calculation to insure good paste release.
This scheme works well for most QFN/MLF components.
Bill Kunkle
Manager of Stencil Technology
MET Assocs.
140 Mt Holly Bypass Unit 10
Lumberton, NJ 08048
www.metassocs.com
Ph: 609 261 2670 Fx: 4007
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of West, Jim
Sent: Thursday, December 28, 2006 9:27 AM
To: [log in to unmask]
Subject: [TN] DRK package
Hi,
Looking for some help with the package shown within this email. The
package virtually sits flush with the PCB, and the pads are directly
under the body of the part. The pads are exposed on the side, but by a
very small amount. I have a lot of questions regarding the processes
from the beginning to the end, but wanted to see if anyone else runs
this type of package and what your experiences have been like? Some
questions would be stencil apertures design guideline, paste height,
after reflow inspection method, and reworking.
Best Regards,
Jim West
Engineering Manager
Nexergy Inc.
www.nexergy.com
tel: (614) 351-6216
fax: (614) 324-1979
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