Jim

Have a look at <http://focus.ti.com/lit/an/scba017d/scba017d.pdf>

I'm guessing DRK is a TI package. QFN/DFN are normally plated whilst panelised, and then sawn or singulated. As a result they
have unprotected lead frame material at the sides. A "toe fillet" is still useful to get heat into the joint during reflow, and
most certainly so for rework or hand assembly (I have a love hate view on these depending on whether I'm my minds on
electrical/thermal performance or my hands are on the hot air gun for prototypes!) 


Best Regards
 
David Greig
______________________________
GigaDyne Ltd
5 Albany Business Centre
Gardeners Street
Dunfermline KY12 0RN
United Kingdom
t: +44 (0)1383 624 975
www.gigadyne.co.uk
______________________________

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of West, Jim
Sent: 28 December 2006 14:27
To: [log in to unmask]
Subject: [TN] DRK package

Hi,
 
Looking for some help with the package shown within this email.  The package virtually sits flush with the PCB, and the pads are
directly under the body of the part.  The pads are exposed on the side, but by a very small amount.  I have a lot of questions
regarding the processes from the beginning to the end, but wanted to see if anyone else runs this type of package and what your
experiences have been like?  Some questions would be stencil apertures design guideline, paste height,
after reflow inspection method, and reworking.    
 
Best Regards,
 


Jim West
Engineering Manager
Nexergy Inc.
www.nexergy.com
tel: (614) 351-6216
fax: (614) 324-1979



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