Hi,
 
Looking for some help with the package shown within this email.  The
package virtually sits flush with the PCB, and the pads are directly
under the body of the part.  The pads are exposed on the side, but by a
very small amount.  I have a lot of questions regarding the processes
from the beginning to the end, but wanted to see if anyone else runs
this type of package and what your experiences have been like?  Some
questions would be stencil apertures design guideline, paste height,
after reflow inspection method, and reworking.    
 
Best Regards,
 


Jim West
Engineering Manager
Nexergy Inc.
www.nexergy.com
tel: (614) 351-6216
fax: (614) 324-1979



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