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December 2006

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Subject:
From:
Dacia Schoolfield <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Dacia Schoolfield <[log in to unmask]>
Date:
Fri, 22 Dec 2006 10:00:51 -0600
Content-Type:
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All -

I need the forum's help on a quality issue that we are experiencing with one
of our customers.

Specifically, we have a customer that is rejecting board assemblies due to
chip-outs (nicks) in the adhesive coating on various resistors. We are
questioning whether or not these chip-outs in the coating are actually
defects.

IPC-A-610 Rev. D (section 9.2) does state workmanship parameters for
adhesive coating, but it only applies to 1206 and larger devices. The
devices in question are 0402's.

Our question: Is there an industry standard quality/workmanship
specification for adhesive coating on devices with a case size smaller than
1206?
I will provide Mr. Steve Gregory some pictures to add to his website, when
he has time.

Kind Regards,
Dacia
 <<Resistor - Adhesive Coating Removed - 1.JPG>>  <<Resistor - Adhesive
Coating Removed - 2.JPG>>  <<Resistor - Adhesive Coating Removed - 3.JPG>>
<<Resistor - Adhesive Coating Removed - 4.JPG>>


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