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December 2006

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Subject:
From:
"Stadem, Richard D." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D.
Date:
Wed, 20 Dec 2006 13:55:22 -0600
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Thanks, Werner.
I forgot to mention that. When profiling a pwb to optimize the preheat
and wave profile, refer to IPC 7350 for mounting the TCs, as well. The
method for attachment of the TC is absolutely critical. For the bottom
side, a completely different reading will be measured if the TC is not
attached to a metal pad or ground plane, than if measuring the pot temp
only (unattached to a foil).

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Werner Engelmaier
Sent: Wednesday, December 20, 2006 1:24 PM
To: [log in to unmask]
Subject: Re: [TN] Wave soldering profiling

Hi Dominic,
First let me recommend IPC-7530 Guidelines for Temperature Profiling for
Mass Soldering Processes (Reflow & Wave).
Second, depending on your purpose, if it is for soldering I would
suggest the top of the PTH but in intimate contact, but also on one lead
of the largest leaded component as well as the center-most solder ball
of the largest BGA.



Werner

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