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Subject:
From:
Robert Lazzara <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Fri, 1 Dec 2006 13:26:16 EST
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text/plain
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Victor, SMOBC does not affect the ENIG process.
 
SMOBC (solder mask over bare copper) is an acronym that generally defines  
the selective solder process (i.e., there will only be assembly solder in areas  
exposed by solder mask).
 
It does not define, however, the bare board surface finish.
 
In this case the end-user instructed SMOBC but failed to indicate a  
preference of bare board surface finish. Two separate issues.
 
Failing to specify a surface finish is frankly common for several  reasons:
    *   Designers have come to know that today's PCB surface  finishes 
sometimes change like the seasons (e.g., why  specify immersion tin today when next 
year's immersion kryptonite  will be en vogue?) 
    *   Buyers can't always get the same surface finish from all suppliers. 
Nail  yourself down to, say, high-temp OSP, and watch how many of your 
suppliers  reply to RFQs with No-Bid.
So if you design for an OEM who plays Wheel-Of-Surface-Finishes,  leaving the 
print to state "SMOBC" and nothing more can save you a load of  ECNs and 
eliminate sourcing limitations.
 
And don't even get me started on Contract Assemblers, who cringe  anytime 
they have to explain to an OEM that there's something mission-critical  missing 
from the print...
 
Bob
 
ROBERT LAZZARA
VP, Business Development
T: (800) 560-9457
F:  (800) 878-5566 (y servicio de mensaje espaņol)
E:  [log in to unmask]
W: _www.CircuitConnectUSA.com_ (http://www.circuitconnectusa.com/) 


 
____________________________________




In a message dated 12/1/2006 12:52:46 P.M. Eastern Standard Time,  
[log in to unmask] writes:

How does  SMOBC effects the ENIG plating  process?

Victor






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