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Subject:
From:
Jerry Dengler <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jerry Dengler <[log in to unmask]>
Date:
Mon, 18 Dec 2006 15:30:31 -0500
Content-Type:
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text/plain (169 lines)
In a Sn/Pb environment (no experience with nitrogen in Pb-Free) I agree
with Rich.  The nitrogen opens the process window but a good
manufacturer can build most assemblies just as well without the added
cost of nitrogen.  That being said there are some designs that simply
will not give good yields without nitrogen.

Jerry Dengler
Production Manager
Pergamon Corporation
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Richard Kraszewski
Sent: Monday, December 18, 2006 2:51 PM
To: [log in to unmask]
Subject: Re: [TN] Nitrogen usage

To come down on the other side of this discussion....

I'd have to say that nitrogen is not necessary in all applications.
There is tendency to just through resources at the process saying that
it should be better (not arguing that it actually won't help!!).  

Sure isn't nice and should help, but is it truly necessary in all
instances?

How much can it cost?  To inert a high usage reflow oven for a year can
easily cost you ~$50K / year.  

In today's world were every penny counts, it's another process parameter
that needs to be closely looked at and at least optimized.  

Rich K / KEG

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Nowland, Russell
Howard (Russell)
Sent: Monday, December 18, 2006 2:13 PM
To: [log in to unmask]
Subject: Re: [TN] Nitrogen usage

John,

I am still waiting to get a quote back from them.  We always used
nitrogen for just about everything and our previous EMS did too.  This
is the first Tier 1 EMS I have worked with that did not.


Russell Nowland
Alcatel-Lucent           
Supply Base Engineer
Address: 14000 Quail Spring Parkway, Suite 300 Oklahoma City, OK 73134
email: [log in to unmask]
Desk: 405-302-1660
Cell: 405-203-0034
Fax: 405-302-1622

-----Original Message-----
From: John Burke [mailto:[log in to unmask]]
Sent: Monday, December 18, 2006 12:35 PM
To: 'TechNet E-Mail Forum'; Nowland, Russell Howard (Russell)
Subject: RE: [TN] Nitrogen usage

I have had this issue too. All Tier 1 - 2 CM ovens are "nitrogen
capable". 

I actually specified Nitrogen on the build requirements when I was
running manufacturing engineering at Extreme Networks and after a time
it was interesting the lengths that the CM would go to on "studies" to
try and persuade my upper management team that it could be switched
off!!!

There is some argument that can be applied to not using it, where for
instance the flux is a high activity system that is subsequently water
washed, but in general, the reality is, that the nitrogen reduces
oxidation of the soldering system and therefore improves the probability
of getting a "right first time" assembly with good probability of field
reliability.

What price are they talking about? The cost of the nitrogen? Or the cost
of the vacuum wall piping runs to take it into the factory?

I do not believe I have ever seen the specification that you refer to
(although I have sometimes wished there was one!)

John

 
 
John Burke
 
(408) 515 4992

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Russ Nowland
Sent: Monday, December 18, 2006 10:07 AM
To: [log in to unmask]
Subject: [TN] Nitrogen usage

Hello Technetter's,

Sometimes in life you find yourself in a pickle and wonder how the heck
you got there.  It always brings me to that famous quote "It is hard to
soar with the eagles when you work with a bunch of turkeys".

I have a question:  I am working with and "MAJOR" EMS that does not use
nitrogen with either Sn/Pb or Pb-free reflow.  In this day and age I
have never heard of this.  They have it available but will only use it
if I require it.  At a price, of course. They don't seem to take into
account it will improve their yields as well.

Is there an IPC, NEMI, or any other standard that requires/recommends N2
usage for either Sn/Pb or Pb-free reflow process?

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