 
| Subject: | |
| From: | |
| Reply To: | |
| Date: | Sat, 16 Dec 2006 12:31:13 +0530 |
| Content-Type: | text/plain |
| Parts/Attachments: |
|
|
Dear all,
Further to our earlier mail on high reliability specs, we are using copper foil construction for the PCB's. Can somebody help me in giving a comparison between foil and laminate construction, especially with reliability in view.
Any inputs on space grade multilayer boards -
i. Specified construction
ii Material
iii Process
iv Thermal Stress requirements
v Rework simulation requirements
Whether MIL PRF55110G requirements will be sufficient for Space grade boards too? Is there any other reliability Standards that agencies like NASA refer? If so what is the thermal stress and rework simulation requirements?
Too many questions, but kindly give a feedback
Rgds
Pradeep Menon
----- Original Message -----
From: "Pradeep" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Saturday, December 16, 2006 10:13 AM
Subject: Re: [TN] Reliability Specs
Dear Werner ,
Thanks for your feedback.
The question is, what % of the total prodn will pass through such stringent tests
We use 180Tg FR4 material along with etchback process in the desmear for a 3 point contact. Considering this do you still justify this or else should we change the material / process
Rgds
Pradeep
----- Original Message -----
From: [log in to unmask]
To: [log in to unmask] ; [log in to unmask]
Sent: Saturday, December 16, 2006 1:59 AM
Subject: Re: [TN] Reliability Specs
Hi Pradeep,
What your suggestions drive at is an additional test procedure sometimes referred to as "cyclic time-to-delamination to prove the capability of the PCB base material to survive the lead-free assembly process.
In my White Paper on specifying PCBs for lead-free assembly, I suggest that "cT288" consisting of 6 thermal cycles to 288°C [3 for reflow simulation + 3 for rework/repair simulation] as a requirement to be included in the PCB 'FAB Notes', particularly for h0rel PCBs.
Werner
**************************************************************
Scanned by eScan Anti-Virus and Content Security Software.
Visit http://www.mwti.net for more info on eScan and MailScan.
**************************************************************
**************************************************************
Scanned by eScan Anti-Virus and Content Security Software.
Visit http://www.mwti.net for more info on eScan and MailScan.
**************************************************************
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
**************************************************************
Scanned by eScan Anti-Virus and Content Security Software.
Visit http://www.mwti.net for more info on eScan and MailScan.
**************************************************************
**************************************************************
Scanned by eScan Anti-Virus and Content Security Software.
Visit http://www.mwti.net for more info on eScan and MailScan.
**************************************************************
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|
