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December 2006

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Subject:
Re: Reliability Specs
From:
Pradeep <[log in to unmask]>
Reply To:
Pradeep <[log in to unmask]>
Date:
Sat, 16 Dec 2006 10:13:23 +0530
Content-Type:
text/plain
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text/plain (47 lines) 
Dear Werner ,

Thanks for your feedback.

The question is, what % of the total prodn will pass through such stringent tests

We use 180Tg FR4 material along with etchback process in the desmear for a 3 point contact. Considering this do you still justify this or else should we change the material / process

Rgds

Pradeep
  ----- Original Message ----- 
  From: [log in to unmask] 
  To: [log in to unmask] ; [log in to unmask] 
  Sent: Saturday, December 16, 2006 1:59 AM
  Subject: Re: [TN] Reliability Specs


  Hi Pradeep,
  What your suggestions drive at is an additional test procedure sometimes referred to as "cyclic time-to-delamination to prove the capability of the PCB base material to survive the lead-free assembly process.
  In my White Paper on specifying PCBs for lead-free assembly, I suggest that "cT288" consisting of 6 thermal cycles to 288°C [3 for reflow simulation + 3 for rework/repair simulation] as a requirement to be included in the PCB 'FAB Notes', particularly for h0rel PCBs.


  Werner

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