Dear all,

We are a PCB manufacturer of multilayer PCB's catering to the high reliability space segment. We are in the process of relooking at our specifications to meet the customer requirements.

Couple of suggestions recvd are

1.    Thermal stress - 6 times at 290 deg C ( we are currently doing 1 cycle at 288 deg C )

2.    Rework Simulation - 5 cycles at 300 deg C ( we are currently doing 5 cycles at 260 deg C)


Can the technet members provide some feedback on these suggestions which will help us in deciding on the right specification

Rgds

Pradeep

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