Bill,
Thanks, but, sorry, I am under a mutual NDA and cannot comment on
specific materials, whether or not I have tested them and what, if any,
the results were.
Bev
________________________________
From: Bill Kasprzak [mailto:[log in to unmask]]
Sent: December 14, 2006 2:01 PM
To: TechNet E-Mail Forum; Bev Christian
Subject: Re: [TN] Qualifying reworkable underfills
Bev,
Have you tried Loctite 3549? It caught my eye in a trade publication due
to it being re-workable.
Bev Christian <[log in to unmask]>
Sent by: TechNet <[log in to unmask]>
12/14/2006 01:50 PM
Please respond to
TechNet E-Mail Forum <[log in to unmask]>; Please respond to
Bev Christian <[log in to unmask]>
To
[log in to unmask]
cc
Subject
[TN] Qualifying reworkable underfills
Technetters,
Back after almost a year off-line.
It has always been my philosophy to thoroughly test ANY chemical that is
going to come in contact with a PCB or PCBA - tapes, labels, inks,
markers, adhesives, cleaners, temp solder masks, permanent solder masks,
flux stops, lubricants for compression fit pins, solder wicks, dusters,
freezing agents, OSPs, cored wires, fluxes, thinners, tacky fluxes,
paste fluxes, solder pastes, underfills, conformal coatings and thermal
compounds.
Lab testing includes copper mirror, halide ion, SIR and electrochemical
migration. It sometimes includes other tests, but let's leave it at
this for the moment.
Here's my problem: I have tested many reworkable underfills from all the
people you can think of and I CAN'T FIND A SINGLE ONE THAT WILL PASS
BOTH IPC SIR AND ECM TESTING. These materials were tested at the same
time that we had control coupons in the chamber (passed), solder pastes
(passed) and normal underfills (passed), so I doubt it was the chambers
(more than one) or that there were water droplets (checked, none
evident).
My customers are pushing me to allow them to use the stuff and I am
resisting. Comments, please.
Bev Christian
RIM
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