I MISSED THAT NOTE, CAN SOMEONE RESEND THAT INFO.
VICTOR,
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Friday, December 01, 2006 10:06 AM
To: [log in to unmask]
Subject: Re: [TN] Solder Voids in Hole barrel after W/S
See the mail by Dieter Bergman on this channel a few weeks ago. There is
a
problem with drilling on lead free laminate materials that is causing
this
issue - it is wide spread.
John
John Burke
(408) 515 4992
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Mike Fenner
Sent: Friday, December 01, 2006 12:29 AM
To: [log in to unmask]
Subject: Re: [TN] Solder Voids in Hole barrel after W/S
Assuming you have adequate top and bottom preheating the cause is almost
certainly poor PCB fabrication. You could try baking out the boards
before
soldering to see if this has an effect on the incidence/severity. This
won't
cure the problem but a change will point to the cause.
Regards
Mike Fenner
Indium Corporation
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Irving Lee
Sent: Thursday, November 30, 2006 4:31 PM
To: [log in to unmask]
Subject: [TN] Solder Voids in Hole barrel after W/S
What are the critical control factors to avoid solder voids in hole
barrel
after W/S ?
We have checked following items , but still have serious solder void
problem
.
1. Good Hole Wall Quality
2. Good solderability for component tail
3. Good HASL thickness
4. No Ionic contamination
Irving Lee
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