Hi Joe!

I've always left them in the tray ball-down when I've baked them, less
handling that way. I never experienced any problems when doing that.
Only other thing you should do is make sure that the tray can withstand
the temperature. Because I've seen on occasion BGA's coming in
non-bakable trays.

-Steve Gregory- 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Macko, Joe @ IEC
Sent: Wednesday, December 13, 2006 1:25 PM
To: [log in to unmask]
Subject: [TN] BGA placement in carrier trays during bake out

Hello Fellow Techs,



A question came up about what industry or best practice is when baking
BGAs in high-temp. carrier trays (i.e., whether BGAs should be facing up
or down in the carrier tray when baked out to avoid potential ball
contamination).

Question -- When baking out BGAs at 125 C, is it common practice to turn
the parts upside down so the balls are facing UP (and not in contact
with any carrier material) or is it acceptable to bake with the parts
facing down into the carrier?



I did not see anything about this in J-STD-033B.  Thanks



-Joe




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