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December 2006

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Subject:
From:
"Macko, Joe @ IEC" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Macko, Joe @ IEC
Date:
Wed, 13 Dec 2006 11:24:48 -0800
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Hello Fellow Techs,



A question came up about what industry or best practice is when baking BGAs
in high-temp. carrier trays (i.e., whether BGAs should be facing up or down
in the carrier tray when baked out to avoid potential ball contamination).

Question -- When baking out BGAs at 125 C, is it common practice to turn the
parts upside down so the balls are facing UP (and not in contact with any
carrier material) or is it acceptable to bake with the parts facing down
into the carrier?



I did not see anything about this in J-STD-033B.  Thanks



-Joe




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