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December 2006

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Subject:
From:
Irving Lee <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, [log in to unmask]
Date:
Sat, 2 Dec 2006 00:00:21 +0800
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text/plain
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text/plain (51 lines)
Yes.  We did a lot of cross section without any abnormality.
 

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Miguel Vallejo
Sent: Friday, December 01, 2006 1:08 AM
To: [log in to unmask]
Subject: Re: [TN] Solder Voids in Hole barrel after W/S

Irving,
Can you elaborate how you derived to the conclusion of having good hole wall quality? Assuming you've eliminated any other obvious anomaly that can cause outgasing, I would drill down on the copper plating concern. Have you had any cross-section done?

Miguel

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Irving Lee
Sent: Thursday, November 30, 2006 8:31 AM
To: [log in to unmask]
Subject: [TN] Solder Voids in Hole barrel after W/S


What are  the critical control factors to avoid solder voids in hole barrel after W/S ?
We have checked following items , but still have serious solder void problem .
 1. Good Hole Wall Quality
 2. Good solderability for component tail  3. Good HASL thickness  4. No Ionic contamination


Irving Lee

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