I need some help in understanding.

 

Are specified requirements are emersion gold plate per

Mil-G-45204 type 2, gold plating thickness maximum of .00003 inches (30

micro inches) over minimum of .00005 inches (50 micro inches) nickel for our PCB

 

Is this a standard that is used widely, any other recommendations? 

 

My supplier has indicated the following.  

The specifications you listed in your e-mail do not apply to the ENIG finish (Immersion Gold, electroless nickel)

Mil -G- 45204 refers to Electroplated Gold, Type 2 is 99.0% purity

 

IPC 6012B Table 3-2 requirements for ENIG are 1.97 u" minimum immersion gold and 118 u" minimum of electroless nickel.

 

 

Which is a better specification? What would give better quality / reliability?  Is there anyway to correlate the two different specifications.  

 

Can I correlate ENIG specs, to that of gold plating.?

 

Dave

 

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