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December 2006

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Subject:
From:
Charlotte Hao <[log in to unmask]>
Reply To:
Asia Committe Task Group Forum <[log in to unmask]>, Charlotte Hao <[log in to unmask]>
Date:
Tue, 26 Dec 2006 01:35:57 -0600
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Dear all,
 
 
The following terms are today's unsure terms. We are looking forward to get your comments. 
Thank you so much!    :-) 

 

7   Assembly Process for Interconnection Structures           互连结构组装工艺

 

75  Joining Technology                                                         连接技术

 

Intermetallic Compound, Solder     金属间化合物,焊料    75.1428

An intermediate layer in a wetted solder connection between the wetted surface and the solder, consisting of the solution of at least one constituent of the wetted surface and at least one constituent of the solder.

润湿表面与焊料之间的润湿焊点内的中间层,由至少一种润湿表面的成分和至少一种焊料成分组成。

 

Equilibrium Wetting                          平衡润湿法                          75.1722

The degree of wetting in which the forces of wetting are in equilibrium with the forces of gravity. The visible indication of this is the wetting balance curve describing the wetting action when the rate of change approaches zero.

润湿力与重力处于平衡状态下的润湿程度。可用变化率趋近于0时的润湿平衡曲线直观表示润湿作用大小。 

 

Lead-Free Solder                             无铅焊料                          75.1904

An alloy that does not contain more than 0.1% lead (Pb) by weight as its constituent and is used for joining components to substrates or for coating surfaces.

其组成成份中铅的含量在重量上不大于0.1%的合金,用于将元件连接到基板或涂覆表面。

 

76  Cleaning and Conformal Coating Processes               清洗和覆形涂敷加工

 

Complex Ion                                      复合离子                              76.0233

An ion composed of two or more ions or radicals that are capable of an independent existence.

由两个以上能独立存在的离子或自由基构成的离子。

 

 Preheat Force                                   预热压力                              75.1984

In hot-bar conductive soldering, that portion of the force profile where light contact pressure is made during preheat between a thermode and the component leads being terminated to allow for wetting of the metals being joined prior to the application of the full bonding force.

在热棒传导焊接中力曲线中的一部分,即预热期间在热电极和待端接的元件引线之间施加轻微接触压力,可在施加全部键合力之前润湿待连接的金属。

 

77  Rework, Repair and Modification                                         返工、修复和修正

Kerf                                                     切口                                      77.0667

A laser-beam or abrasive-jet cut (slit) in a film component as a part of the trimming operation.

膜元件内的激光束或研磨喷射切口,作为修整操作的一部分。

 

 

 
Charlotte  郝宇
Translator/Technical Resources Assistant
IPC WOFE, a subsidiary of IPC, Inc.
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