Dear all,
 
Merry Christmas!
 
Today's unsure terms are coming. We are looking forward to get your comments. 
Thank you so much!    :-) 

 

7   Assembly Process for Interconnection Structures           互连结构组装工艺

 

74  Bare Chip Placement and attachment                                 裸芯片放置和贴装

 

First Bond                                          首键合                           74.0512

The initial termination in a sequence of bonds made to form a conductive path. (See also "Second Bond.")

形成一个导电通路的一系列键合中的第一个端子。（参见“第二键合”。）

 

Neckbreak                                         断颈                               74.0796

A break in a bond immediately above a ball bond. 

位于球形键合正上方的键合断裂。

 

Chip-in-Board (CIB)                          板内芯片直装                74.1617

An electronic component where a chip is inserted into an opening of a ceramic or glass-epoxy substrate and bonded by wire bonding or TAB techniques. The object of this technique is to reduce the thickness of the COB assembly. The chip may be covered by a resin after bonding.

一种电子元器件， 芯片嵌入陶瓷或玻璃纤维环氧树脂基板的开口内，并通过引线键合或TAB技术键接在一起。这种技术的目的是减少芯片直接贴装（COB）组件的厚度。也可在键合后用树脂覆盖芯片。

 

Face Down Bonding                         面向下键合                          74.1753

A method of attaching a component or circuit chip to a substrate by inverting the chip and bonding chip contacts to the mirror-image contact points on the substrate.

元件或电路芯片与基板和连接方法，翻转芯片，使芯片接触点与基板上的镜像接触点键合。

 

75  Joining Technology                                                         连接技术

 

Muffle                                                     隔离罩                                  75.0780

An enclosure with a rectangular or oval cross-section that is located between the heating elements and the parts being processed that contains the atmosphere required for the reflow soldering process.

为加热器和待加热元件之间的一个长方形或椭圆截面的密封罩。罩内装有回流焊工艺要求的气体（氮气等）。

 

Resistance Soldering                       电阻焊接                              75.1248

Soldering by a combination of pressure and heat generated by passing a high current through two mechanically-joined conductors.

通过流经两个机械连接的导体的高电流而产生的压力和热的结合而完成的焊接。

 

 

Charlotte  郝宇
技术助理
Specialist Technical Program
IPC WOFE, a subsidiary of IPC, Inc.
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