Dear all,
 
Today's unsure terms are coming. We are looking forward to get your comments. 
Thank you so much!    :-) 

 

7   Assembly Process for Interconnection Structures           互连结构组装工艺

 

70  General       (Assembly Process Issues)                                            通用（组装工艺方面）

 

Specks                                               色晕（亮斑）                       70.2054

Ink splatter not part of a bar code pattern.

不属条形码图形部分的油墨飞溅。

 

74  Bare Chip Placement and attachment                                 裸芯片放置和贴装

 

Angled Bond                                      角形键合           74.0039

The impression of the first and second bonds that are not in a straight line.

第一个和第二个键合压痕不在一条直线上。

 

Capillary                                                毛细管                 74.0175

A hollow bonding tool used to guide wire to the bonding site and to be used to apply pressure during the bonding cycle. (See also "Wedge Tool")

用于将金属线导引至键合位置并在键合周期中施加压力的中空键合工具。（参见“楔焊工具”。）

 

Chopped Bond                                     折弯键合             74.0212

A bond with excessive deformation such that the strength of the bond is greatly reduced.

由于过度变形而导致键合强度严重下降的键合。

 

Chip-and-Wire                                      芯片- 金属线      74.0206

An assembly method that uses discrete wires to interconnect back-bonding die to lands, lead frames, etc.

用分立金属线实现背连芯片与连接盘、引线框架互连的组装方法。

 

Eutectic Die Attach                           共晶芯片贴装  74.0454

The mounting of a semiconductor die to a base material with a preform of a eutectic metal alloy that is brought to its eutectic melting temperature.

采用达到共晶熔融融温度的共晶金属合金预成型焊料，将半导体芯片安装到基材上的过程。

 

Charlotte  郝宇
技术助理
Specialist Technical Program
IPC WOFE, a subsidiary of IPC, Inc.
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