Hi Andy,
Yes. I also had the same mail from him. I ask him to send me the mail to my another mailbox. It's good.
I copy it to you.
Hi Taiga,
The following is your comments.
Entry/Backup Material 引入/支持材料 盖板/垫板（材料） 51.1720
A material which when placed on the top (entry) and/or bottom (backup) of a stack of printed boards being drilled or routed, supports the edges of drilled holes or routed profile such that the presence of burrs is minimized.
在钻孔或布板时，放置于一叠印制板的顶部（引入）和/或底部（支持），支撑钻孔边缘或切板侧面，以便将毛刺减少到最低的材料。
钻孔或外形加工时，放在印制板的顶部（盖板）和/或底部（垫板）用于支撑钻孔和外形边沿的材料，其目的是为了减少毛刺产生。
-----------------------------------------------------------------------------------------------------------
Laser Direct Imaging (LDI) Method 激光直接成像（LDI）法 52.1895
The selective exposure of patterns onto a photosensitive material (such as dry film or liquid) without using a working phototool (artwork master).
不使用底片（底图）而选择暴露感光材料（如干膜或液体）上的图形。
不使用底片（底图）直接将图形在感光材料（如干膜或湿膜）上选择性曝光的方法。
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Layer-to-Layer Registration 层间重合度 层间对位 55.1899
The process of aligning circuit features (lands) on individual layers of a printed board through the use of tooling image location features (fiducials) or tooling holes.
通过使用定位图象位置特征（基准）或定位孔对准印制板各层的电路特征（连接盘）的过程。
Charlotte 郝宇
技术助理
Specialist Technical Program
IPC WOFE, a subsidiary of IPC, Inc.
爱比西国际科技管理咨询(上海)有限公司
上海市宜山路711号
Tel: 021-54973435
Fax: 021-54973437
邮编：200233
________________________________
From: Duan, Shi Hao - Andy BSCE QA PEK [mailto:[log in to unmask]]
Sent: 2006-12-20 (星期三) 10:17
To: Charlotte Hao
Subject: FW: [TGA] Today's unsure terms for you to review
Hi Charlotte,
Why i got the clobber from Taiga Xu? Do you have the same phenomenon?
Best regards,
Duan Shi Hao (Andy)
------------------------------------------------------------------------
Quality Department
Beijing Siemens Cerberus Electronics Limited
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No.18,XinXi Road, ShangDi Information Industry Base,HaiDian District, Beijing, 100085 China
Tel : +86 10 62962255 Ext. 602 (Office) or 126 (Lab)
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________________________________
From: TGAsia [mailto:[log in to unmask]] On Behalf Of Taiga Xu
Sent: Thursday, December 14, 2006 11:27 PM
To: [log in to unmask]
Subject: Re: [TGA] Today's unsure terms for you to review
>Entry/Backup Material òyè?/?§3?2?á? ??°?/μae°?￡¨2?á?￡(c) 51.1720
>
>A material which when placed on the top (entry) and/or bottom (backup) of a stack of printed boards being drilled or routed, supports the edges of drilled holes or routed profile such that the presence of burrs is minimized.
>
>?ú×ê?×?ò21/4°?ê±￡?·???óúò?μtó??AE°?μ??￥2?￡¨òyè?￡(c)oí/?òμ×2?￡¨?§3?￡(c)￡??§3?×ê?×±??μ?ò?D°?2à?ae￡?ò?±?1/2???′ì1/4?éùμ1/2×?μíμ?2?á??￡
×ê?×?òíaD?1/4ó1¤ê±￡?·??úó??AE°?μ??￥2?￡¨??°?￡(c)oí/?òμ×2?￡¨μae°?￡(c)ó?óú?§3?×ê?×oííaD?±???μ?2?á?￡?AE???μ?ê??aá?1/4?éù??′ì2úéú?￡
Dì1úéú￡¨é???￡(c)
Taiga Xu
QA Engineer
Shenzhen Shennan Circuits Co;Ltd
The Catic Shahe South Industrial Zone Shenzhen China
Tel:+86 755 8609 6478 Cell:+86 135 1063 4289
Fax:+86 755 8609 6378
P.O.Box:Shahe 113,Shenzhen
Postcode:518053
E-mail:[log in to unmask]
________________________________
From: Charlotte Hao <[log in to unmask]>
Reply-To: Asia Committe Task Group Forum <[log in to unmask]>, Charlotte Hao <[log in to unmask]>
To: [log in to unmask]
Subject: [TGA] Today's unsure terms for you to review
Date: Wed, 13 Dec 2006 21:16:03 -0600
>Dear all,
>
>From today, We'll send the rest of unsure terms of IPC-T-50 after DUANGUAN Reviewing Meeting to TGASIA, for you to review.
>
>Thank you so much.
>
>We'll send 6 unsure terms each day. The following terms are of today. The green colored words are the categoris in which the terms is.
>
>
>44 Reinforcement/Constraining Core/Heat Dissipation Material ????2?á?/1/4DD3/4/é￠èè2?á?
>
>
>
>Creel 3/4-?á1/4ü 44.0315
>
>A device used as a yarn package rack to hold warp ends for a section beam.
>
>?a·?ì???3/4-?á1ì?¨3/4-????μ?ò???é′??1/4ü×°???￡
>
>
>
>Treater Dirt (Base Materials) ′|àíAE÷·???￡¨?ù2?)44.2103
>
>An inclusion which appears to be or is confirmed by analysis to be a type of resin particle which has been caught within the structure of the impregnation treater, to be picked up by a subsequent use of the treater; usually in some form of carbonization due to excessive exposure to the treater's heat.
>
>?AEo?ê??ò3/4-·???è·è?ê?ê÷??á￡×óíaà′1/4D?ó??￡??úoóD?ê1ó?′|àíAE÷ê±±?1/4D1ü?ú1/2t×?μ?′|àíAE÷1/2á11?ú￡?óéóú1y?è±(c)??óú′|àíAE÷μ?èèá???í¨3￡ò?ì1/4?ˉ??μ?D?ê1/2′ae?ú?￡
>
>
>
>Knot (Base Materials) 1/2á(?ù2?) 44.1887
>
>A clump of reinforcement material formed either by the yarn within the web of the fabric or which was deposited onto the web during the treating process.
>
>?ú′|àí1y3ì?D￡?óé?ˉ??í??úé′???òí?é?é′?????yD?3éμ?ò?í?????2?á??￡
>
>
>
>45 Conductive Materials (Foil, Film or Plating) μ1/4μ?2?á?￡¨2-?￠?¤?ò?AE2?￡(c)
>
>
>
>As-Fired 12?e 45.0054
>
>The condition (values) of thick-film components or the smoothness of ceramic base materials, after they have been processed in a firing furnace and prior to trimming or polishing.
>
>?D?÷?ò?×1a?°?úèèè??ˉ?D′|àíμ?o??¤?a1/4t?òì?′é?ù2?μ?AE1/2???èμ?×′??(êy?μ)?￡
>
>
>
>46 Component Attaching Material (Conductive/Non-Conductive) ?a1/4t1ì?¨2?á?￡¨μ1/4μ?/·?μ1/4μ?￡(c)
>
>
>
>Creep Resistant Holding Power (Pressure Sensitive Tape) ?1è?±?±￡3?á|￡¨?1á|???D1/2o′?￡(c)46.1869
>
>The ability of a pressure sensitive adhesive tape to resist static forces of shear applied to the same plane as the backing.
>
>?1??1/2o′?3/4?óDμ??1×÷ó?óúí?ò????§3??aeμ?3/42ì?1/4??Dá|μ??üá|?￡
>
>
>
>5 Fabrication Process for Interconnection Structures ?￥á?1/2á11?AE?ì1¤ò?
>
>
>
>51 Mechnical Processes ?úDμ1/4ó1¤
>
>
>
>Helix Angle ?YDy1/2? 51.0601
>
>The angle of the spiral generated by the flute of a drill with respect to the axis of the drill.
>
>×êí·??D1/42??à??óú×êí·?á?òD?3éμ??YDy1/2??￡
>
>
>
>
>
>Charlotte o?ó?
>
>1/41/4ê??úàí
>Specialist Technical Program
>IPC WOFE, a subsidiary of IPC, Inc.
>°(r)±è?÷1ú1/4ê?AE1/41/41üàí×é?ˉ(é?o￡)óD?T1??3/4
>é?o￡êDò?é1/2?·711o?
>Tel: 021-54973435
>Fax: 021-54973437
>óê±à￡o200233
>
>
>________________________________
>
>From: Charlotte Hao
>Sent: 2006-11-27 (D?AEúò?) 8:07
>To: [log in to unmask]
>Subject: Batch 1 terms on 27th,Nov.
>
>
>
>
>Dear All,
>
>
>These are 7 terms which are uncertain this afternoon, please give us your opinions. : )
>
>Thanks and regards
>
>
>Charlotte
>
>
>
>Drill Bit ×êí· 51.1702
>
>A rod with spiral flutes (grooves) and an obtuse angled point with sharpened cutting edges used to make holes by rotary action.
>
>ò???′?óD?YDy°1/42?μ???￡?í·2??a′?óDèD?úμ???1/2?1/4a￡?í¨1yDy×a???ˉ?AE×÷?×?￡
>
>
>
>Dry Glass (Clad Laminate) ?é2￡￡¨?22-2??1°?￡(c) 41.1706
>
>A general reference to the appearance of a laminate where the reinforcement is highly visible, due to low/lost resin content or poor wetting/encapsulation of the resin to the reinforcement, although the resin coverage is acceptable.
>
>ò???2??1°?ía1?μ?3￡1ae2???￡?AE??D￡?óéóúê÷??o?á?μí/?eê§?òê÷????????2?á?μ?èóêa/?ü·a2?á1/4￡?ê1μ?????2?á?·?3￡?÷??￡?3/4?1üê÷???2???êê??é1/2óêüμ??￡
>
>
>
>Embedded Fiber (Base Materials) ????￡¨?ù2?￡(c) 44.1825
>
>An inclusion which has an insignificant width or diameter but has significant length, usually but not always in a curly or twisted configuration, generally from organic sources such as clothing or packaging materials.
>
>ò????í?è?ò?±3/4??éo????￠μ?3¤?è1/2??÷??μ?1/4D?ó??￡?í¨3￡?aμ?2?×üê?í??ú?ò?¤?úíaD?￡?ò?°??′óúóD?ú??￡?è?21/4á??ò°ü×°2?á??￡
>
>
>
>Equilibrium Wetting AE1/2oaèóêa·¨ 75.1722
>
>The degree of wetting in which the forces of wetting are in equilibrium with the forces of gravity. The visible indication of this is the wetting balance curve describing the wetting action when the rate of change approaches zero.
>
>èóêaá|ó???á|′|óúAE1/2oa×′ì???μ?èóêa3ì?è?￡?éó?±??ˉ?ê?÷1/2üóú0ê±μ?èóêaAE1/2oa?ú???±1?±íê3/4èóêa×÷ó?′óD??￡
>
>
>
>Eutectic Die Attach 123/4§D3/4AE?ìù×° 74.0454
>
>The mounting of a semiconductor die to a base material with a preform of a eutectic metal alloy that is brought to its eutectic melting temperature.
>
>2éó?′?μ1/2123/4§è?èúèú???èμ?123/4§1/2eê?o?1/2e?¤3éDío?á?￡?1/2?°?μ1/4ì?D3/4AE?°2×°μ1/2?ù2?é?μ?1y3ì?￡
>
>
>
>Embedded Copper (Base Materials) ??í-￡¨?ù2?￡(c) 45.1718
>
>An inclusion which is composed of copper and sourced from the cladding, and may be particles from treatment transfer, broken away copper tooth, or spurious copper.
>
>?′óú?22?μ?óéí-×é3éμ?1/4D?ó??￡??é?üê?′|àí×aòAEμ?í-??á￡?￠??á?μ?í-′ì￡?ò2?é?üê?1/4ùí-?￡
>
>
>
>End Mill ???3μ? 51.1719
>
>A rod with straight or spiral flutes (grooves) sharpened as a cutting surface(s) and a flat or shaped end with cutting teeth, used for surface or side milling by rotary action.
>
>ò???′?óD′1?±?ò?YDy×′°1/42?μ?1?í2￡?±??÷1/4a3é·aeà?μ?±í?aeoíAE1/2μ??ò?3??D?×′μ???2?￡?′?óD·aeà?μ??à3Y￡?í¨1yDy×a???ˉó?×÷±í?ae?ò2à?ae?D?￥?￡
>
>
>
>Entry/Backup Material òyè?/?§3?2?á? 51.1720
>
>A material which when placed on the top (entry) and/or bottom (backup) of a stack of printed boards being drilled or routed, supports the edges of drilled holes or routed profile such that the presence of burrs is minimized.
>
>?ú×ê?×?ò21/4°?ê±￡?·???óúò?μtó??AE°?μ??￥2?￡¨òyè?￡(c)oí/?òμ×2?￡¨?§3?￡(c)￡??§3?×ê?×±??μ?ò?D°?2à?ae￡?ò?±?1/2???′ì1/4?éùμ1/2×?μíμ?2?á??￡
>
>
>
>Exposure Time (Component) AE???ê±1/4?￡¨?aAE÷1/4t￡(c) 30.1914
>
>The compensation factor which accounts for the time after bake that the component manufacturer requires to process the components prior to bag seal.
>
>oae?3/4oóó?óúê±1/4??1/4á?μ?213￥òò??￡??aAE÷1/4t?AE?ìéìòa?ó?ú×°è??ü·a′ü?°′|àí?aAE÷1/4t?￡
>
>
________________________________
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