Dear all,
 
Today's unsure terms is coming. Please give us your hand. Thank you a lot!    :-) 

 

5   Fabrication Process for Interconnection Structures       互连结构制造工艺

52  Imaging and Application of Resists and Inks        抗蚀剂和油墨的成像与应用

 

Laser Direct Imaging (LDI) Method 激光直接成像（LDI）法      52.1895

The selective exposure of patterns onto a photosensitive material (such as dry film or liquid) without using a working phototool (artwork master).

不使用底片（底图）而选择暴露感光材料（如干膜或液体）上的图形。

 

54  Material Removal Processes, Including Etchin          包括蚀刻的材料除去过程 

 

Abrasive Trimming                               磨蚀调整                    54.1318

Adjusting the value of a film component by notching it with a finely-adjusted stream of an abrasive material against the resistor surface.

在电阻表面, 用微调研磨材料流量开槽的方法改变薄膜元件的值。

 

55  Lamination, Sequential Deposition, and Moulding Processes      层压、顺序沉积及模制加工

     

Layer-to-Layer Registration             层间重合度                   55.1899

The process of aligning circuit features (lands) on individual layers of a printed board through the use of tooling image location features (fiducials) or tooling holes.

通过使用定位图象位置特征（基准）或定位孔对准印制板各层的电路特征（连接盘）的过程。

 

56  Thermal Cure/Firing Processes                             热固化/烘烤加工

 

Co-Firing                                            共烧                               56.0219

The simultaneous processing of thick-film circuit elements during one firing cycle.

在一次焙烧周期中对厚膜电路元件的同时处理。

 

Heat of Fusion                                   熔化热量                       56.0593

The quantity of heat required to convert a unit weight of solid material to its liquid state.

将一个单位重量的固态材料转变为液态所需要的热量。

 

6   Types and Performance of Interconnection Structures for Electronic Packaging  电子封装互连结构及性能

 

64  Discrete Wiring Boards(Organic Substrates)                                   散线印制板（有机基板）

 

Bounce Pad (Discrete Wiring)            回弹垫片（分立布线）   64.1588

 An isolated area in a copper plane which acts solely as a stop for the laser drilling operation.

铜面上一个只用来停止激光钻孔操作的孤立区域。

 

 

Charlotte  郝宇
技术助理
Specialist Technical Program
IPC WOFE, a subsidiary of IPC, Inc.
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上海市宜山路711号
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