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December 2006

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Subject:
From:
Tina Nerad <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Thu, 14 Dec 2006 10:51:12 -0600
Content-Type:
text/plain
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text/plain (116 lines)
Have you registered yet? 

 

IPC's January 2007 workshops are right around the corner! This is your
chance to catch up on the latest topics in the circuit board industry.

 

Lead Free Surface Finishes:  The Road to RoHS Compliance 

Tuesday, January 16, 2007 Phoenix, AZ 8:30 am - 11:30 am

 

The electronics industry is moving rapidly to lead free soldering. With
this movement, the industry is seeing a greater importance in solderable
finishes that protect the bare copper prior to assembly. How will this
impact solderability and long term reliability? Attend this workshop to
find out. Learn what printed board manufacturers must do to be
successful with lead free finishes.

 

To register, please cut and paste the following link into your browser:
www.ipc.org/AdvPWB

      

Advanced PWB Troubleshooting: Identification, Analysis and Prevention of
Critical PWB Defects 

Tuesday, January 16, 2007 Phoenix, AZ 1:00 pm - 4:00 pm

 

This intense workshop will give you the tools for advanced problem
solving of printed circuit board defects. Defects such as interconnect
separation, delamination, wedge voids, plating folds, microvoids,
surface pitting, and hole wall pull-away carry significant costs.
Participants will learn how to recognize problems and take corrective
action before cost is incurred. Participants should have some knowledge
of the PCB fabrication process.

 

To register, please cut and paste the following link into your browser:
www.ipc.org/AdvPWB.

 

PCB Laminate Materials and the RoHS Change:  IPC-4101 Specification,
Bromine Free and Reliability 

Wednesday, January 17, 2007 Phoenix, AZ 8:00 am - 5:00 pm

 

This new workshop will explain how the market challenges faced in CCL
and how the industry specifications are being changed to face these
challenges. The European legislation will be discussed, as will the
latest specification sheet proposals for IPC-4101 "Specifications for
Base Materials for Rigid and Multilayer Printed Boards." The impact will
be on laminate resin systems will be identified and the potential
reliability impact discussed. Options for determining how to call out
laminates will be detailed. In addition, curing agent change and
opportunities to improve resin systems will be analyzed.

 

To register, please cut and paste the following link into your browser:
www.ipc.org/PCBLam

 

Advanced Packaging Technologies and Future Trends Workshop 

Thursday, January 18, 2007 Phoenix, AZ

 

As the first interconnection element after the semiconductor chip
itself, IC packaging technologies are the primary gate keepers of
electronic system performance. There are a myriad of different types of
packages available, each normally targeted for a specific range of
semiconductor devices. With so many options, understanding the basics of
IC packaging - how they are constructed, what drives cost and what
limits performance - is critical to the successful product design.

 

To register, please cut and paste the following link into your browser:
www.ipc.org/APTech

 

For information on other upcoming 2007 events, please visit our website
at www.ipc.org.

 

 

 

 


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