I'm being advised 4mm3 at present.
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of Lester Subrattee
Sent: 13 December 2006 20:50
To: [log in to unmask]
Subject: Re: [LF] AEA publishes China RoHS final standards translation
and labeling requirements
I keep seeing two numbers when referring to the threshold for the definition
"small components" in the EIP-C category.
1.2 mm cubed and 4 mm cubed.
Anyone know which is the correct number?
Thanks,
LS
-----Original Message-----
From: Tom Davenport [mailto:[log in to unmask]]
Sent: Wednesday, December 13, 2006 1:46 PM
To: [log in to unmask]
Subject: Re: AEA publishes China RoHS final standards translation and
labeling requirements
I agree with John, much thanks to the AEA for the translation.
I have two questions to post to the forum:
1. I believe previous forum posting mentioned RoHS testing for the China
market would have to be performed in China. I do not see anything in this
regard in the documents. Did I miss it?
2. The document calls out components as > than or < than 1.2mm2. That is
really small considering an 8L SOIC is >16mm2. They mention a QFP as an
example, but that part would be as big or bigger than the SOIC, depending on
leadcount. Does anybody know where the 1.2mm2 number comes from and how it
makes sense?
Best regards,
Tom Davenport
VP Quality, Reliability and Technology
Ramtron International Corporation
1-719-481-7139
www.ramtron.com
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]] On Behalf Of John Burke
Sent: Wednesday, December 13, 2006 12:01 AM
To: [log in to unmask]
Subject: [LF] AEA publishes Chhina RoHS final standards translation and
labelling requirements
Importance: High
FYI, check out this release and follow the links:
http://tinyurl.com/uacr9
THANKS AEA........
John Burke
(408) 515 4992
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