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Date: | Mon, 4 Dec 2006 12:13:09 EST |
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Brian,
Looks funny to me, too, but not due to it being a few holes.
First observation: There's apparent solder mask lifting/blistering. I expect
to see uniform solder mask even when the substrate exhibits delamination,
but these views show an effect appearing more like solder mask blistering than
ply separation.
Second observation: I see solder mask separating from a trace.
Initial thoughts: This is a failure of the solder mask. The mask wasn't
uniformly cured (or there was inadequate surface preparation prior to masking --
or both).
Q1: Is there an available edge-view of the PCB? The closer/the better.
Q2: Has anyone performed IPC solder mask testing for peel strength or
solvent resistivity?
Q3: Has anyone cracked open a box that hasn't gone into the field to se if
the condition is pre-existing?
ROBERT LAZZARA
VP, Business Development
T: (800) 560-9457
F: (800) 878-5566
____________________________________
In a message dated 12/4/2006 11:30:34 A.M. Eastern Standard Time,
[log in to unmask] writes:
The following files show the two sides of a PCB in a professional
weather station. This shows four dark areas which the manufacturer has
ascribed to water penetration. These are centred on a hole. The whole
thing seems funny to me, as it has happened on only a few of the holes.
I understand that it was housed in a water-tight case, not very far from
the Pacific coast. I was not able to ascertain the laminate type, but it
would not surpise me if it were paper based (FR3?).
Has anyone seen anything like this?
____________________________________
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