Subject: | |
From: | |
Reply To: | |
Date: | Thu, 28 Dec 2006 22:09:01 -0800 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
I need some help in understanding.
Are specified requirements are emersion gold plate per
Mil-G-45204 type 2, gold plating thickness maximum of .00003 inches (30
micro inches) over minimum of .00005 inches (50 micro inches) nickel for our PCB
Is this a standard that is used widely, any other recommendations?
My supplier has indicated the following.
The specifications you listed in your e-mail do not apply to the ENIG finish (Immersion Gold, electroless nickel)
Mil -G- 45204 refers to Electroplated Gold, Type 2 is 99.0% purity
IPC 6012B Table 3-2 requirements for ENIG are 1.97 u" minimum immersion gold and 118 u" minimum of electroless nickel.
Which is a better specification? What would give better quality / reliability? Is there anyway to correlate the two different specifications.
Can I correlate ENIG specs, to that of gold plating.?
Dave
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|