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Date: | Sat, 16 Dec 2006 10:13:23 +0530 |
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Dear Werner ,
Thanks for your feedback.
The question is, what % of the total prodn will pass through such stringent tests
We use 180Tg FR4 material along with etchback process in the desmear for a 3 point contact. Considering this do you still justify this or else should we change the material / process
Rgds
Pradeep
----- Original Message -----
From: [log in to unmask]
To: [log in to unmask] ; [log in to unmask]
Sent: Saturday, December 16, 2006 1:59 AM
Subject: Re: [TN] Reliability Specs
Hi Pradeep,
What your suggestions drive at is an additional test procedure sometimes referred to as "cyclic time-to-delamination to prove the capability of the PCB base material to survive the lead-free assembly process.
In my White Paper on specifying PCBs for lead-free assembly, I suggest that "cT288" consisting of 6 thermal cycles to 288°C [3 for reflow simulation + 3 for rework/repair simulation] as a requirement to be included in the PCB 'FAB Notes', particularly for h0rel PCBs.
Werner
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